1) Semiconductor Equipment Spending Hits $135B
Global equipment billings grew 15% in 2025, driven by AI-related demand in advanced logic and memory. Back-end segments saw the strongest growth, with test (+55%) and packaging (+21%) increasing due to HBM and more complex packaging requirements. Asia continues to dominate spending, led by Taiwan, China, and Korea.
2) Semiconductor Market Set to Reach $1.32T in 2026
Gartner forecasts 64% market growth, largely driven by memory. DRAM and NAND prices are expected to rise sharply, with tight supply extending into 2027. AI chips are projected to represent around 30% of total semiconductor revenue.
3) Intel and Google Expand AI Infrastructure Collaboration
The partnership focuses on scaling AI data centers using Xeon CPUs alongside custom IPUs to offload networking and storage tasks. This reflects the shift toward heterogeneous architectures combining general-purpose and specialised compute.
4) Terafab Signals Vertically Integrated AI Manufacturing
Intel, Tesla, SpaceX, and xAI are linked to a “Terafab” concept aiming to deliver large-scale AI compute through integrated design, manufacturing, and packaging. Execution will depend heavily on EUV tool availability and advanced packaging capacity.
5) Anthropic Secures Multi-GW TPU Capacity
Anthropic expands its partnership with Google and Broadcom to secure large-scale TPU capacity for future models. The strategy combines TPUs, GPUs, and AWS Trainium, showing a move toward multi-architecture compute flexibility.
6) Intel Demonstrates Ultra-Thin GaN Chiplet
Intel introduced a GaN-on-silicon chiplet with integrated control logic on 300mm wafers. The design supports high-frequency and power-efficient applications, targeting data centers and RF systems.
7) European Chips Skills Academy Launches
The EU-backed platform offers more than 60 semiconductor courses to address the talent gap across manufacturing and design. It supports workforce scaling linked to Europe’s semiconductor expansion plans.
8) IQM Expands Quantum Presence in the U.S.
IQM opened a quantum technology centre in Maryland, strengthening links with federal labs and academia. The focus is on superconducting quantum systems and integration with HPC environments.
9) Co-Packaged Optics Gains Momentum
Co-packaged optics is emerging as a key interconnect technology for AI systems, enabling higher bandwidth and lower power consumption. Adoption will depend heavily on advanced packaging and photonics integration.
10) TSMC Reports Strong March 2026 Revenue
TSMC reported strong growth, driven by AI and advanced-node demand. First-quarter results also show continued momentum supported by both node scaling and advanced packaging services.
11) Japan Increases Funding for Rapidus 2nm Program
An additional $4 billion brings total funding to around $15 billion, reinforcing Japan’s ambition to build domestic advanced logic capacity and reduce reliance on external foundries.
12) Samsung Signals Strong Q1 2026 Performance
Guidance points to improved profitability, driven by memory pricing recovery and strong demand for advanced semiconductor products linked to AI infrastructure.
13) Taiwan Raises Concerns Over Technology Security
Authorities report increasing efforts to access semiconductor talent and intellectual property. The situation highlights the growing strategic importance of advanced manufacturing and rising geopolitical pressure around the sector.
